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AHigh temperatures have a continuous effect on electronic products: degradation of insulation;damage to components; thermal aging of materials; cracking of low melting point solder joints and solder joints falling off. Devices will fail due to overheating, and the reliability of electronic devices will be reduced......

QThe basic problem of thermal design.

AThe effective output power of electronic devices is much smaller than the required input power, and this excess power is converted into heat and dissipated. And heat determines the heat-up. As electronic components and devices become increasingly miniaturized, the volumetric power density of the device is greatly increased.......

QThe objectives of thermal design.

A1.Thermal design should meet the requirements of equipment reliability;；2.thermal design should meet the requirements of the thermal environment in which the equipment is expected to work。3.thermal design should meet the requirements of the limitations of the cooling system; 4.reduce costs.

QThermal design should consider the issues.

A Solar radiation, dust, fiber particles, life cycle costs, thermal transients, maintainability, condensation of water vapor, coolant, etc.

QBasic principles of heat transfer.

A a, heat flows from the high temperature zone to the low temperature zone; b, the heat emitted from the high temperature zone must be equal to the heat absorbed from the low temperature zone. The process of heat transfer can be distinguished into two categories: a, where the temperature at various points in the object does not change with time, .......

QThe basic ways of heat transfer.

AHeat conduction, convection, and radiation. Heat conduction, heat convection and heat radiation are used in semiconductor refrigeration, whose interior is dominated by heat conduction to transfer heat, while the heat transfer between the joint and the air is mainly heat convection. They may occur separately or in two or three forms simultaneously.

QThree common measures of thermal design:consumption reduction, heat conduction, and layout.

Reduced consumption is not to let the heat generated; thermal conductivity is the heat conduction away from the impact; layout is the heat is not dissipated but through measures to isolate heat-sensitive devices; somewhat similar to the electromagnetic compatibility aspects of the three measures for the emission source, propagation path, sensitive equipment. Layout design is often taken.......

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