AHigh temperatures have a continuous effect on electronic products: degradation of insulation;damage to components;
thermal aging of materials; cracking of low melting point solder joints and solder joints falling off. Devices will fail due to overheating,
and the reliability of electronic devices will be reduced......
AThe effective output power of electronic devices is much smaller than the required input power,
and this excess power is converted into heat and dissipated. And heat determines the heat-up. As electronic components and devices become
increasingly miniaturized, the volumetric power density of the device is greatly increased.......
A1.Thermal design should meet the requirements of equipment reliability;；2.thermal design should meet the requirements
of the thermal environment in which the equipment is expected to work。3.thermal design should meet the requirements of the limitations of the cooling system; 4.reduce costs.
A Solar radiation, dust, fiber particles, life cycle costs, thermal transients, maintainability, condensation of water vapor, coolant, etc.
A a, heat flows from the high temperature zone to the low temperature zone; b, the heat emitted from the high
temperature zone must be equal to the heat absorbed from the low temperature zone. The process of heat transfer can be distinguished into two categories: a, where the temperature at
various points in the object does not change with time, .......
AHeat conduction, convection, and radiation. Heat conduction, heat convection and heat radiation are used in semiconductor refrigeration, whose
interior is dominated by heat conduction to transfer heat, while the heat transfer between the joint and the air is mainly heat convection. They may occur separately or in two or three forms simultaneously.
Reduced consumption is not to let the heat generated; thermal conductivity is the heat conduction away from the impact; layout is the heat
is not dissipated but through measures to isolate heat-sensitive devices; somewhat similar to the electromagnetic compatibility aspects of the three measures for the emission source, propagation path, sensitive equipment.
Layout design is often taken.......