A

The effective output power of electronic devices is much smaller than the required input power, and this excess power is converted into heat and dissipated. And heat determines the heat-up. As electronic components and devices become increasingly miniaturized, the volumetric power density of the device is greatly increased. A low thermal resistance path needs to be provided to ensure the smooth transfer of heat out to meet reliability requirements. (The effective output power of electronic equipment is much smaller than the required input power, and this excess power will be converted into heat and dissipated, and the heat dissipated determines the temperature rise, which in turn raises the working environment temperature of electronic equipment. Due to the increasing miniaturization of electronic components and equipment, the volume power density of the equipment has increased significantly. (Therefore, a low thermal resistance path needs to be provided to ensure the smooth transfer of heat out to meet the long-term, stable operation of the product.)